Thank you for the in-depth breakdown of an impressive new circuit integration Technique! I was initially worried about how they'd wick heat away from the bottom die, but the connections are more integral than I had anticipated, and so your 30 minute Gaming stress tests confirmed only the top layer needs a heatsink. I'm also Very impressed and surprised with the NPU and Ray Tracing being on par or exceeding the latest Snapdragon 8 Gen 6 demos, which themselves are beyond the capabilities of last gen x86 iGPU Laptops. It's just a shame we won't have access to HarmonyOS or this SoC in the USA for some time, but hopefully some bleed-over international competition will keep our offerings from stagnating too far behind.
谷歌被美国制裁的真厉害
又是個只有Tensor受傷的世界
我覺得相當厲害，被全方位封鎖還能搞出這樣的東西，值得點讚！
9:50 Google: 對對對又是我啦
真心建議谷歌不要再浪費台積電的產能了，乖乖專心搞好軟體生態吧，硬體交給高通跟聯發科就好了
謝謝！難得一見👍
这几年谷歌被美国制裁的厉害😂
看到极客湾的视频上线,必须先点赞,有空再看
华为这个逻辑折叠真的让我很惊叹，明年华为的cpu看报道说比今年的进步更大
新技術看起來很有料 果然辦法是人想出來的 喔不對 是天才想出來的🤣
这期含量高啊，居然物理切片了，先赞后看
今日刚刚买了，16+512 mate90 promax
能达到骁龙和天玑3纳米的水平，已经很牛了，也就是代差一年多点
硅通孔，混合键合，逻辑堆叠，背部供电，能用的先进工艺都用上了，就差EUV了。🎉
极客湾确实强，什么时候也针对最新桌面芯片也搞个这种解说还真不错
google這下真是拉完了🤣
Thank you for the in-depth breakdown of an impressive new circuit integration Technique! I was initially worried about how they'd wick heat away from the bottom die, but the connections are more integral than I had anticipated, and so your 30 minute Gaming stress tests confirmed only the top layer needs a heatsink. I'm also Very impressed and surprised with the NPU and Ray Tracing being on par or exceeding the latest Snapdragon 8 Gen 6 demos, which themselves are beyond the capabilities of last gen x86 iGPU Laptops. It's just a shame we won't have access to HarmonyOS or this SoC in the USA for some time, but hopefully some bleed-over international competition will keep our offerings from stagnating too far behind.
😂还顺便鞭尸了一下网易云
論突破還得是華為。
明年又折一下又上一个高度，华为真的开挂了一样，逆风而上